MediaTek has officially introduced the Dimensity 9400 Plus, its latest flagship chipset. This new offering is essentially an overclocked version of the Dimensity 9400, which was unveiled last year.

The naming reflects a minor upgrade, similar to Qualcomm’s past strategies with the Snapdragon 8 series. The Dimensity 9400 Plus is anticipated to debut in several smartphone models shortly, with launches expected from brands like OPPO and vivo.

The Dimensity 9400 Plus features an All Big Core design, integrating a powerful ARM Cortex-X925 core clocked up to 3.73GHz, along with three Cortex-X4 cores and four Cortex-A720 cores. MediaTek emphasizes that this configuration enhances both single-threaded and multi-threaded performance, ultimately delivering a top-tier user experience for Android devices.

Built on TSMC’s second-generation 3nm process (N3E), the Dimensity 9400 Plus boasts improved power efficiency, reportedly up to 40% better than its predecessor. Given the Dimensity 9400’s already impressive efficiency in testing, the new chipset promises to further extend battery life in devices that adopt it.

Additionally, MediaTek has incorporated its NPU 890 in the Dimensity 9400 Plus, enabling the support of DeekSeek R1 on-device. This positions the chipset as the first in the industry to leverage the four key technologies of DeekSeek R1, including Mixture-of-Experts, Multi-Head Latent Attention, Multi-Token Prediction, and FP8, all of which enhance processing speeds.

On the graphics side, the chipset features a 12-core ARM Immortalis-G925 GPU that enhances mobile gaming experiences by providing PC-level effects and supporting sustained peak performance. Lastly, the introduction of MediaTek UltraSave 4.0 is expected to yield a notable 18% power saving for 5G usage, benefiting users who rely on mobile connectivity.

The first smartphones powered by the Dimensity 9400 Plus are expected to be released in Q2 2025.