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Recently, discussions have emerged regarding Huawei’s advancements in designing and manufacturing its own sophisticated chips. Some reports suggested that the company was nearing the capabilities of top-tier global chip designers and manufacturers, particularly those based in the US.

However, a new report indicates that Huawei may not be as close to competing with these industry leaders as previously thought. A primary focus of the conversation revolves around manufacturing process nodes, which pertain to the size and efficiency of the transistors on a chip.

Smaller process nodes, such as 5nm or even 2nm, represent more advanced technology. A higher transistor density typically correlates with enhanced performance and energy efficiency when executed properly.

Previously, Huawei’s Kirin X90 processor was said to utilize a 5nm process, notably found in devices like the foldable MateBook. Contrary to earlier reports, new information reveals that the Kirin X90 actually relies on SMIC’s 7nm process node, specifically the N+2 variant.

This indicates that Huawei is using the same chip technology as last year’s Mate 70 series smartphones. This finding is significant because it shows that Huawei and SMIC are currently two generations behind the cutting-edge chip technology, rather than the “one generation gap” that some had optimistically suggested.

The significant obstacles Huawei faces include stringent sanctions that prevent both it and SMIC from acquiring the necessary Extreme Ultraviolet (EUV) lithography machines essential for producing chips at the 5nm process node and beyond. While there were theories about achieving 5nm using older Deep Ultraviolet (DUV) machines, these methods are complicated and often yield lower production rates, making mass manufacturing difficult.

As the semiconductor landscape continues to advance, the gap between Huawei and global leaders is expected to widen. Industry experts predict that upcoming flagship devices, such as Apple’s iPhone 18, will utilize even more advanced 2nm application processors.

This ongoing evolution underscores the significant challenges Huawei faces in its pursuit of matching the capabilities of leading semiconductor firms.

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