MediaTek may unveil its next flagship mobile chip, the Dimensity 9500, before Qualcomm rolls out the Snapdragon 8 Elite 2. This new SoC is expected to enhance features such as ray tracing and AI performance, building on the foundation set by last year’s Dimensity 9400.

Recent insights from Digital Chat Station, a credible Chinese leaker, have revealed key details about the performance benchmarks of the upcoming Dimensity 9500. According to these reports, the initial Geekbench 6 scores for the Dimensity 9500 are comparable to those of Qualcomm’s Snapdragon 8 Elite 2, with the Dimensity achieving over 3,900 points in single-core tests and exceeding 11,000 in multi-core tests.

In contrast, the Snapdragon 8 Elite 2 reportedly scores over 4,000 in single-core performance and similarly surpasses the 11,000 mark in multi-core evaluations. The Dimensity 9500 is set to be substantially more powerful than its predecessor, the Dimensity 9400, which clocked in at around 2,900 points for single-core tests and over 9,200 for multi-core tests.

Reports suggest that the Dimensity 9500 could achieve over 4 million points on the AnTuTu benchmark, aligning it closely with the expected performance of the Snapdragon 8 Elite 2. Recent information indicates that MediaTek is utilizing TSMC’s N3P process for the Dimensity 9500.

This third-generation 3nm node promises improved power efficiency and performance. The SoC is expected to feature a robust architecture, including 16 MB of L3 cache and 10 MB of system-level cache, as well as support for 4-channel LPDDR5x RAM.

Smartphone manufacturers from China, such as Vivo and OPPO, are anticipated to introduce devices powered by the Dimensity 9500 between October and December, signaling a competitive period in the smartphone market, coinciding with the launch of Apple’s iPhone 17 lineup.