Apple has consistently been a leader in adopting cutting-edge semiconductor technology for its devices. With this in mind, it comes as no surprise that the upcoming iPhone 18 Pro, set for release in 2026, is expected to feature the advanced 2nm A20 chipset.

This latest information was revealed by analyst Jeff Pu through a research note provided to GF Securities. Pu anticipates that not only the iPhone 18 Pro but also the Pro Max and a foldable iPhone will incorporate the 2nm A20 chipset.

He also mentioned potential design modifications for the chip. One key innovation is that the A20 will utilize TSMC’s Wafer-Level Multi-Chip Module (WMCM) packaging technology.

This development means that the device’s RAM will be integrated directly onto the chip’s wafer alongside the CPU, GPU, and Neural Engine, rather than being situated next to the chip. The implications of these advancements for user experience are significant.

The 2nm process promises enhanced performance, improved energy efficiency, and superior thermal management. Moreover, the reduced size of the components could create additional internal space, allowing Apple to either include more components or accommodate a larger battery.

Looking ahead to 2026, Apple is expected to introduce the iPhone 18 series, which is rumored to include the standard iPhone 18, an iPhone 18 Air, the iPhone 18 Pro, and the iPhone 18 Pro Max. Notably, Apple may also launch its first-ever foldable iPhone during this timeframe.

This development could be linked to the introduction of the iPhone 17 Air, which aimed to explore fitting components into a slimmer body. The entire lineup will likely feature the A20 chipset.

Apple is not alone in pursuing the 2nm pathway; other companies like Qualcomm are also rumored to introduce their own 2nm chipsets in 2026.