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Qualcomm and Apple are at the forefront of semiconductor technology, recently launching chips produced using the advanced 3nm process. Both companies plan to unveil 2nm chips in the upcoming years, further highlighting their leadership in the sector.

In contrast, Huawei still lags behind U.S. chip manufacturers, but the company shows no signs of conceding defeat. Huawei’s CEO, Ren Zhengfei, expressed optimism regarding the company’s chip development in an interview with the People’s Daily.

He reassured that the chip issues caused by U.S. export controls shouldn’t be a significant concern. While he acknowledged that Huawei’s capabilities are not as advanced as those of its American counterparts, he asserted that the gap is manageable.

He has stated, “Our single chip is still behind the U.S. by a generation,” and emphasized that Huawei employs innovative methodologies to bridge this divide without being hindered by software limitations. The U.S.

Entity List and the ongoing trade war have profoundly affected semiconductor advancements in China. Nevertheless, this does not mean that Huawei or other Chinese firms should be underestimated.

Many semiconductor companies depend on Dutch firm ASML’s advanced EUV lithography machines. However, Chinese companies like SMIC are exploring alternatives to these machines.

Despite reports indicating that SMIC’s yields are lower compared to those of TSMC, with estimates around one-third, and costs significantly higher, this effort signals a commitment to progress. Ultimately, while the path to technological parity may be slow, it appears that Chinese semiconductor firms are in it for the long haul.

The current geopolitical landscape emphasizes the need for China to focus on self-sufficiency in technology, aiming for a more sustainable future. For now, Huawei remains determined to pursue its semiconductor ambitions, signaling that it is not ready to relinquish its goals just yet.

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