HONOR recently made waves in the smartphone market with the launch of the Magic V3, touted as one of the slimmest foldable smartphones, featuring a sleek 4.35mm profile. Following this success, the company is preparing to unveil its successor, likely named the HONOR Magic V5. Ahead of this launch, HONOR executive Li Kun indicated that the new foldable will incorporate the standard version of the Snapdragon 8 Elite chipset. Details from a Geekbench listing have surfaced, confirming the use of this powerful chip, setting high expectations for performance.

The leaked Geekbench entry for the HONOR Magic V5, identified as the model MHG-AN00, revealed some impressive specifications. The device will be powered by Qualcomm’s Snapdragon 8 Elite, an octa-core processor with six cores clocked at 3.53GHz and two cores running at an impressive 4.47GHz. This powerhouse chip is paired with an Adreno 830 GPU, which should enhance gaming and graphics performance significantly. Additionally, the listing indicates that the Magic V5 will feature a substantial 16GB of RAM, surpassing the 12GB expected in the upcoming Samsung Galaxy Z Fold 7, and will run on Android 15 right out of the box.

In terms of design, Li Kun has teased that the Magic V5 aims to be the lightest and thinnest foldable smartphone available. To claim this title, the device will need to maintain a thickness of under 9mm when folded. The current model, the Magic V3, measures 9.2mm when folded, making the challenge for its successor even greater. Further enhancements may include an improved battery setup, with rumors of a dual-cell battery configuration resulting in an effective capacity of around 5,950mAh.

Moreover, it is speculated that the HONOR Magic V5 will be equipped with a 50MP main camera, complemented by a 200MP periscope telephoto lens and an ultra-wide-angle lens. The anticipated launch for this exciting new foldable smartphone is set for June, positioning it to compete directly with other foldable devices from manufacturers like OPPO, Vivo, and Samsung.