TSMC is widely recognized as a leading player in the tech industry, known for its advanced chip manufacturing capabilities. The company produces semiconductors for prominent clients in sectors such as mobile processors and artificial intelligence hardware.

A significant milestone for TSMC is the upcoming 2nm (N2) production process, which has been confirmed for mass production this year. Despite challenges faced by competitors like Samsung Foundry, TSMC has firmly established its reputation in the semiconductor market by consistently delivering high-performance technology.

This reliability has made it the preferred supplier for industry giants like Qualcomm, Apple, NVIDIA, and AMD. During a recent North American Technology Symposium, TSMC announced its readiness to commence mass production of N2 wafers in the latter half of 2025.

Notably, TSMC will utilize gate-all-around (GAA) nanosheet transistors, a technology that Samsung previously attempted to implement with its own 3nm process but encountered significant setbacks. Insiders report that TSMC already enjoys a high yield rate for its 2nm chips.

The 2nm process has immense implications for the AI sector as well. TSMC has positioned itself as a key player in the production of AI chips, supplying components for NVIDIA’s products and AMD’s upcoming EPYC ‘Venice’ CPUs aimed at data centers.

Additionally, TSMC’s 2nm wafers will be used in next-generation smartphone chips from Qualcomm and Apple. The N2 technology promises notable improvements in performance, with TSMC estimating a performance boost of 10% to 15%, coupled with a 25% to 30% reduction in power consumption and a 15% increase in transistor density when compared to the N3E process used for its 3nm chips.

Furthermore, the company is working on enhanced versions of the N2 process, with plans to introduce N2P technology in 2026 and the N2X process in 2027, all while maintaining the 2nm scale with additional enhancements.